Process Flow
Process Flow
Flex-Rigid Board Process Flow
PCB Process Capabilities
|
project |
Parameters |
|
Number of layers |
1-40layer |
|
Maximum PCB size |
730mm*630mm |
|
Finished PCB thickness |
0.3mm~5.0mm |
|
Mechanical drill hole size |
0.15mm~6.5mm |
|
Laser drill size |
75μm~150μm |
|
Maximum copper thickness |
10OZ |
|
Thinnest core thickness |
0.05mm |
|
Minimum line width (20±3 surface copper ) |
0.05mm/2mil |
|
Minimum line spacing (20±3 surface copper ) |
0.05mm/2mil |
|
Minimum circuit ring |
3mil |
|
Minimum outline Tolerance |
±0.1mm |
|
project |
Mass production process capabilities |
Extreme range capability |
|
Maximum size |
630*730mm |
630*730mm |
|
Hole position tolerance |
±0.05mm |
±0.038mm |
|
Mechanical aperture size |
Ø0.2mm~Ø6.5mm |
Ø0.15mm~Ø6.5mm |
|
Laser drill size |
100μm |
Ø75μm~Ø150μm |
|
Minimum slot hole size |
Ø0.50mm |
Ø0.45mm |
|
PTH size tolerance |
±0.075mm |
±0.05mm |
|
NPTH size tolerance |
±0.05mm |
±0.05mm |
Drilling
Plating
line
|
project |
Mass production process capabilities |
Extreme range capability |
|
electroplating process production size |
≤730mm |
≤735mm |
|
Thickness of electroplating process |
0.3mm~2.0mm |
0.2mm~2.4mm |
|
Hole copper thickness |
13μm~25μm |
13μm~40μm |
|
Surface copper thickness uniformity |
R≤0.004mm |
R≤0.002mm |
|
Hole copper thickness uniformity |
±0.005mm |
±0.003mm |
|
through-hole depth capability |
8:1 |
10:1 |
|
Blind hole depth capability |
0.8:1 |
1:1 |
|
project |
Mass production process capabilities |
Extreme range capability |
|
PCB thickness |
0.075~5.0mm |
0.05~5.0mm |
|
Expose position tolerance |
±0.015mm |
±0.008mm |
|
Min hole ring |
Unilateral≥0.04mm |
Unilateral≥0.03mm |
|
1/3 OZ base copper minimum line width/line spacing |
0.05mm/0.05mm |
0.045mm/0.045mm |
|
1/2 OZ base copper minimum line width/line spacing |
0.075mm/0.075mm |
0.05mm/0.05mm |
|
1 OZ base copper etching tolerance |
0.1mm/0.1mm |
0.075mm/0.075mm |
|
1/3 OZ bottom copper etching tolerance |
±0.005mm |
±0.005mm |
|
1/2 OZ bottom copper etch tolerance |
±0.005mm |
±0.005mm |
PCBA Process Capabilities
|
ITEM |
General capability |
Special capability |
|
Max size |
50x50mm-810×490mm |
810×490mm |
|
Min PITCH |
0.4mm-4mm |
0.38mm3.8mm |
|
Min PIN distance |
0.15mm |
0.14mm |
|
Min BGA diameter |
0.25MM |
0.22MM |
|
Min size of components |
0201 CHIP |
01005 CHIP |
|
Max size of components |
32mm |
45mm |
|
Max height of SMT components |
≤10mm |
13mm |
|
control precision of solder paste thickness |
±0.04mm |
±0.03mm |
|
offset precision of solder paste printing |
±0.05mm |
±0.025mm |
|
Precision of element migration |
≤0.15mm |
≤0.10mm |
|
precision of element to float high |
≤0.15mm |
≤0.10mm |
|
Minimum distance between components and parts |
0.3mm |
0.25mm |
|
Minimum distance between components and parts(Form-In-Place) |
≥0.6mm |
0.4~0.6mm |
|
minimum spacing between parts and test(Form-In-Place) |
≥0.7mm |
0.5~0.7mm |
|
minimum width of glue(Form-In-Place) |
0.8mm8 |
0.6mm6 |
|
minimum distance between parts and shape edge(Form-In-Place) |
≥1mm |
0.7~1mm |
