Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower
  • Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led TowerDouble Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower
  • Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led TowerDouble Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower
  • Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led TowerDouble Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower
  • Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led TowerDouble Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower
  • Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led TowerDouble Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower
  • Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led TowerDouble Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower

Double Sided Printed Circuit Board Pcb Making Machine Tubi8 Led Tower

The following is about Akeson® Double sided printed circuit board pcb making machine tubi8 led tower related, I hope to help you better understand 1-2 Layers PCB.

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Product Description

Akeson® Double sided printed circuit board pcb making machine tubi8 led tower From China


You are welcomed to come to our factory to buy the latest selling, low price, and high-quality Double sided printed circuit board pcb making machine tubi8 led tower. We look forward to cooperating with you. 

PCB

 

1) Layer:2 layer pcb

2) Board finished thickness: 1.6mm

3) Material: FR-4

4) Min. drilled hole size: 0.35mm

5) Min. Line width:  6mil (0.15mm)

6) Min.Line spacing: 6mil (0.15mm)

7) Surface finish/treatment: Immersion gold

8) Copper thickness: 1 OZ

10) Solder mask color: Green

 11)Inner packing: Vacuum packing / Plastic bag

      Outer packing: Standard carton packing

12) Sample or mass produce, 5 to 8 days lead time

13) OEM/ODM is acceptable

 

Deliverables
1/Quotes in 24 hours or less   
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Sunshine has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
 

 

  

Reference - Our Akeson® Production Capability for Multilayer PCB/Rigid borad

 

Item

 

M-

Layer count

1-30 layers

Material

FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.

Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui

Maxpanel size

32±20(800mm±508mm)

Min width/space(min)

4mil/4mil

Max copper weight

140um(4oz) for inner layer

175um(5oz) for outer layer

Min machine drill size

0.2mm(8mil)

Via hole tpye

Blind/Burried/plugged

Thickness of finished board

0.20-6.0mm

Tolerance

Registration of innerlayer to of innerlayer:±3mil

Accuracy  of  hole position:±2mil

Tolerance of dilled slot:±3mil

Tolerance of PTH diameter:±3mil

Tolerance of NPTH diameter:±2mil

PTH  hole copper thichness: 0.4-2mil

Image to image tolerance:±3mil

Tolerance of etching:±1mil

Solder mask registration tolerance: ±2mil

Finished board : Thickness<=1.0mm: +/-0.1mm

             Thickness>0.1mm:+/-10%

Outline router: +/-0.1mm

Outline Score: +/-0.2mm

Color of solder mask

Green, Black, Blue,Red, White and so on

Surface freatment

HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask

Hardness of solder solder

>=6H

Outline finished

CNC, V-CUT, Punching

Peel strength of line

≥61B/in

Warp and twist

≤0.7%

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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