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FPC Plate Soft Gold
Technical discription:China factory Akeson® 2L fpc plate soft gold application medical fpc ultra-thin Copper micro-hole appearance zero defect FPC
if have Gerber file. please send violet(at)akesoncircuit(dot)com(dot)cn
Flexible pcb
layer: 2 layer Flexible pcb
material: PI
Board thickness: 0.09mm
Surface finish: immersion gold
Min through hole: 0.2mm
Min line width: 0.1mm(4mil)
Min line space: 0.1mm(4mil)
Akeson® Flex board capability:
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Technical Specification
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Materials
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Polyimide/Polyester
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Remark&Test Method
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Number of Layer
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FPCB 1-8/Rigid-flex:3-6
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Min.Trace
Width/Space |
Single Side
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0.050mm(2mil)
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Double Side
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0.050mm(2mil)
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Min.Hole
Diameter |
Drilling(P.T.H.)
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φ0.15mm
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Punching
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φ0.50mm
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Dimension
Tolerance |
Conductor Width
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20%
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W≤0.5mm
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Hole Diameter(H)
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0.05mm
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H≤1.5mm
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Accumulated
Pitch |
0.05mm
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P≤25mm
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Outline Dimension
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±0.1mm
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L≤50mm
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Conductors And
Outline |
±0.07mm
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C≤5.0mm
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Surface Treatment On Terminal
And Land Area |
Au(0.03-1.5um)
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Ni(1-6um)
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Sn(7-20um)
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Peeling Strength(180° Direction)
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1.0kg f/cm
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IPC-TM-650 2,4,9
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Solder Heat Resistance
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260/10
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Quickly |
Sample(Normal) |
Mass(Normal) |
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Single-sided: |
1-2 days |
3-5 days |
7-8 days |
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Double-sided: |
2-3 days |
5-8 days |
8-10 days |
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4 Layers: |
3-4 days |
8-10 days |
10-12 days |
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6 Layers: |
5-6 days |
10-12 days |
12-14 days |
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8 Layers: |
6-8 days |
10-12 days |
14-16 days |
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10 Layers: |
8-10 days |
12-14 days |
16-18 days |
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12 Layers: |
10 days |
14-16 days |
16-18 days |
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>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab
