The following is about Akeson® HDI board electronic prototyping boards with bga pcb support Multilayer PCB related, I hope to help you better understand HDI PCB.
Item
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M-
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Layer count
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1-30 layers
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Material
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FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
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Maxpanel size
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32±20(800mm±508mm)
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Min width/space(min)
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4mil/4mil
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Max copper weight
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140um(4oz) for inner layer
175um(5oz) for outer layer
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Min machine drill size
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0.2mm(8mil)
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Via hole tpye
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Blind/Burried/plugged
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Thickness of finished board
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0.20-6.0mm
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Tolerance
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Registration of innerlayer to of innerlayer:±3mil
Accuracy of hole position:±2mil
Tolerance of dilled slot:±3mil
Tolerance of PTH diameter:±3mil
Tolerance of NPTH diameter:±2mil
PTH hole copper thichness: 0.4-2mil
Image to image tolerance:±3mil
Tolerance of etching:±1mil
Solder mask registration tolerance: ±2mil
Finished board : Thickness<=1.0mm: +/-0.1mm
Thickness>0.1mm:+/-10%
Outline router: +/-0.1mm
Outline Score: +/-0.2mm
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Color of solder mask
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Green, Black, Blue,Red, White and so on
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Surface freatment
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HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
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Hardness of solder solder
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>=6H
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Outline finished
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CNC, V-CUT, Punching
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Peel strength of line
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≥61B/in
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Warp and twist
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≤0.7%
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