Multilayer PCB Rigid-Flex Board For SSD
  • Multilayer PCB Rigid-Flex Board For SSDMultilayer PCB Rigid-Flex Board For SSD
  • Multilayer PCB Rigid-Flex Board For SSDMultilayer PCB Rigid-Flex Board For SSD
  • Multilayer PCB Rigid-Flex Board For SSDMultilayer PCB Rigid-Flex Board For SSD
  • Multilayer PCB Rigid-Flex Board For SSDMultilayer PCB Rigid-Flex Board For SSD
  • Multilayer PCB Rigid-Flex Board For SSDMultilayer PCB Rigid-Flex Board For SSD
  • Multilayer PCB Rigid-Flex Board For SSDMultilayer PCB Rigid-Flex Board For SSD

Multilayer PCB Rigid-Flex Board For SSD

The following is about Akeson® Multilayer PCB Rigid-Flex Board For SSD related, I hope to help you better understand Multilayer PCB Rigid-Flex Board For SSD.

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Product Description

Akeson® Multilayer PCB Rigid-Flex Board For SSD  in China

if have Gerber file or enquire. please email is violet(at)akesoncircuit com cn

Deliverables
1/Quotes in 24 hours or less 
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Akeson has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
Products infomation

 

Akeson® Multilayer pcb

 

1) Layer: 14 layer

2) Board finished thickness: 1.6mm

3) Material: FR-4

4) Min. drilled hole size: 0.25mm

5) Min. Line width:  3mil (0.075mm)

6) Min.Line spacing: 3mil (0.075mm)

7) Surface finish/treatment: OSP

8) Copper thickness: 1 OZ

10) Solder mask color: green

 11)Inner packing: Vacuum packing / Plastic bag

      Outer packing: Standard carton packing

12) Sample or mass produce, 6 to 18 days lead time


Reference - Our Production Capability for Multilayer PCB/Rigid borad

 

Item
 
M-
Layer count
1-30 layers
Material
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
Maxpanel size
32±20(800mm±508mm)
Min width/space(min)
4mil/4mil
Max copper weight
140um(4oz) for inner layer
175um(5oz) for outer layer
Min machine drill size
0.2mm(8mil)
Via hole tpye
Blind/Burried/plugged
Thickness of finished board
0.20-6.0mm
Tolerance
Registration of innerlayer to of innerlayer:±3mil
Accuracy  of  hole position:±2mil
Tolerance of dilled slot:±3mil
Tolerance of PTH diameter:±3mil
Tolerance of NPTH diameter:±2mil
PTH  hole copper thichness: 0.4-2mil
Image to image tolerance:±3mil
Tolerance of etching:±1mil
Solder mask registration tolerance: ±2mil
Finished board : Thickness<=1.0mm: +/-0.1mm
             Thickness>0.1mm:+/-10%
Outline router: +/-0.1mm
Outline Score: +/-0.2mm
Color of solder mask
Green, Black, Blue,Red, White and so on
Surface freatment
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
Hardness of solder solder
>=6H
Outline finished
CNC, V-CUT, Punching
Peel strength of line
≥61B/in
Warp and twist
≤0.7%

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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