The following is about Akeson® Multilayer PCB Rigid-Flex Board For SSD related, I hope to help you better understand Multilayer PCB Rigid-Flex Board For SSD.
Akeson® Multilayer PCB Rigid-Flex Board For SSD in China
if have Gerber file or enquire. please email is violet(at)akesoncircuit com cn
	Deliverables
1/Quotes in 24 hours or less 
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Akeson has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
Products infomation
Akeson® Multilayer pcb
1) Layer: 14 layer
2) Board finished thickness: 1.6mm
3) Material: FR-4
4) Min. drilled hole size: 0.25mm
5) Min. Line width: 3mil (0.075mm)
6) Min.Line spacing: 3mil (0.075mm)
7) Surface finish/treatment: OSP
8) Copper thickness: 1 OZ
10) Solder mask color: green
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Sample or mass produce, 6 to 18 days lead time
	
Reference - Our Production Capability for Multilayer PCB/Rigid borad
| 
				 
					Item
				 
				 | 
			
				 
					M-
				 
			 | 
		
| 
				 
					Layer count
				 
			 | 
			
				 
					1-30 layers
				 
			 | 
		
| 
				 
					Material
				 
			 | 
			
				 
					FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
				 
				
					Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
				 
			 | 
		
| 
				 
					Maxpanel size
				 
			 | 
			
				 
					32±20(800mm±508mm)
				 
			 | 
		
| 
				 
					Min width/space(min)
				 
			 | 
			
				 
					4mil/4mil
				 
			 | 
		
| 
				 
					Max copper weight
				 
			 | 
			
				 
					140um(4oz) for inner layer
				 
				
					175um(5oz) for outer layer
				 
			 | 
		
| 
				 
					Min machine drill size
				 
			 | 
			
				 
					0.2mm(8mil)
				 
			 | 
		
| 
				 
					Via hole tpye
				 
			 | 
			
				 
					Blind/Burried/plugged
				 
			 | 
		
| 
				 
					Thickness of finished board
				 
			 | 
			
				 
					0.20-6.0mm
				 
			 | 
		
| 
				 
					Tolerance
				 
			 | 
			
				 
					Registration of innerlayer to of innerlayer:±3mil
				 
				
					Accuracy  of  hole position:±2mil
				 
				
					Tolerance of dilled slot:±3mil
				 
				
					Tolerance of PTH diameter:±3mil
				 
				
					Tolerance of NPTH diameter:±2mil
				 
				
					PTH  hole copper thichness: 0.4-2mil
				 
				
					Image to image tolerance:±3mil
				 
				
					Tolerance of etching:±1mil
				 
				
					Solder mask registration tolerance: ±2mil
				 
				
					Finished board : Thickness<=1.0mm: +/-0.1mm
				 
				
					             Thickness>0.1mm:+/-10%
				 
				
					Outline router: +/-0.1mm
				 
				
					Outline Score: +/-0.2mm
				 
			 | 
		
| 
				 
					Color of solder mask
				 
			 | 
			
				 
					Green, Black, Blue,Red, White and so on
				 
			 | 
		
| 
				 
					Surface freatment
				 
			 | 
			
				 
					HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
				 
			 | 
		
| 
				 
					Hardness of solder solder
				 
			 | 
			
				 
					>=6H
				 
			 | 
		
| 
				 
					Outline finished
				 
			 | 
			
				 
					CNC, V-CUT, Punching
				 
			 | 
		
| 
				 
					Peel strength of line
				 
			 | 
			
				 
					≥61B/in
				 
			 | 
		
| 
				 
					Warp and twist
				 
			 | 
			
				 
					≤0.7%
				 
			 | 
		
	
 
	
 
| 
				 | 
			
				Quickly | 
			
				Sample(Normal) | 
			
				Mass(Normal) | 
		
| 
				Single-sided: | 
			
				1-2 days | 
			
				3-5 days | 
			
				7-8 days | 
		
| 
				Double-sided: | 
			
				2-3 days | 
			
				5-8 days | 
			
				8-10 days | 
		
| 
				4 Layers: | 
			
				3-4 days | 
			
				8-10 days | 
			
				10-12 days | 
		
| 
				6 Layers: | 
			
				5-6 days | 
			
				10-12 days | 
			
				12-14 days | 
		
| 
				8 Layers: | 
			
				6-8 days | 
			
				10-12 days | 
			
				14-16 days | 
		
| 
				10 Layers: | 
			
				8-10 days | 
			
				12-14 days | 
			
				16-18 days | 
		
| 
				12 Layers: | 
			
				10 days | 
			
				14-16 days | 
			
				16-18 days | 
		
| 
				>14 Layers: | 
			
				>=10 days | 
			
				>=16 days | 
			
				>=16 days | 
		
	
	
 
	
 
	U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab