PCB Board For Android Phone
  • PCB Board For Android PhonePCB Board For Android Phone

PCB Board For Android Phone

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Product Description

Akeson® PCB Board for android phone


Akeson Circuit Factory 14Years Experience and more than 1000 Staffs

 
Multilayers PCB Board,Rigid PCB,Flex PCB,MCPCB

1) Material: FR4; 
2) Certificate: UL, ISO, TS16949; 
3) T/T,Western Union, Paypal; 
4)OEM service; 
5)High quality. 

Akeson® Mutilayers PCB HDI Circuit Board


1. ONE-STOP-SERVICE

2. OEM service

3. Gerber file needed

4. PCB clone with sample

5. Quality guarantee and professional after-sell service



Reference - Our Akeson® Production Capability for Multilayer PCB/Rigid borad


Item
Multilayers PCB High Density Circuit Board
Layer count
1-30 layers
Material
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
Maxpanel size
32±20(800mm±508mm)
Min width/space(min)
4mil/4mil
Max copper weight
140um(4oz) for inner layer
175um(5oz) for outer layer
Min machine drill size
0.2mm(8mil)
Via hole tpye
Blind/Burried/plugged
Thickness of finished board
0.20-6.0mm
Tolerance
Registration of innerlayer to of innerlayer:±3mil
Accuracy of hole position:±2mil
Tolerance of dilled slot:±3mil
Tolerance of PTH diameter:±3mil
Tolerance of NPTH diameter:±2mil
PTH hole copper thichness: 0.4-2mil
Image to image tolerance:±3mil
Tolerance of etching:±1mil
Solder mask registration tolerance: ±2mil
Finished board : Thickness<=1.0mm: +/-0.1mm
Thickness>0.1mm:+/-10%
Outline router: +/-0.1mm
Outline Score: +/-0.2mm
Color of solder mask
Green, Black, Blue,Red, White and so on
Surface freatment
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
Hardness of solder solder
>=6H
Outline finished
CNC, V-CUT, Punching
Peel strength of line
≥61B/in
Warp and twist
≤0.7%

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