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Printed Circuit Board PCBA Ssembly

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Product Description

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Akeson® Detailed Product Description:

China PCBA Assembly OEM Manufacturing Shenzhen PCBA with One Stop PCBA Service

if have Gerber file and bom list. please send violet(@)akesoncircuit.com.cn

Printed circuit board

1) Layer: 4 layer

2) Board finished thickness: 1.6mm

3) Material: FR-4

4) Min. drilled hole size: 0.35mm

5) Min. Line width: 6mil (0.15mm)

6) Min.Line spacing: 6mil (0.15mm)

7) Surface finish/treatment:Immersion gold

8) Copper thickness: 1 OZ

10) Solder mask color: Black

11)Inner packing: Vacuum packing / Plastic bag

Outer packing: Standard carton packing

12) Sample or mass produce, 3 to 8 days lead time

Akeson® PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point

Reference - Our Production Capability for Multilayer PCB/Rigid borad

	Quickly	Sample(Normal)	Mass(Normal)
Single-sided:	1-2 days	3-5 days	7-8 days
Double-sided:	2-3 days	5-8 days	8-10 days
4 Layers:	3-4 days	8-10 days	10-12 days
6 Layers:	5-6 days	10-12 days	12-14 days
8 Layers:	6-8 days	10-12 days	14-16 days
10 Layers:	8-10 days	12-14 days	16-18 days
12 Layers:	10 days	14-16 days	16-18 days
>14 Layers:	>=10 days	>=16 days	>=16 days

Note:Specially Board Regards document specific request

U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab