TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • TG FR4 HDI FR4 Multilayer PCB Printed Circuit BoardsTG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • TG FR4 HDI FR4 Multilayer PCB Printed Circuit BoardsTG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • TG FR4 HDI FR4 Multilayer PCB Printed Circuit BoardsTG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • TG FR4 HDI FR4 Multilayer PCB Printed Circuit BoardsTG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • TG FR4 HDI FR4 Multilayer PCB Printed Circuit BoardsTG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • TG FR4 HDI FR4 Multilayer PCB Printed Circuit BoardsTG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards

TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards

The following is about Akeson® Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards related, I hope to help you better understand Mutilayer PCB.

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Product Description

Akeson® Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards from China

You can rest assured to buy Akeson® Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards from our factory and we will offer you the best after-sale service and timely delivery.

 

Deliverables
1/Quotes in 24 hours or less   
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Sunshine has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
Products infomation
8 layer,
Material:FR4(Tg180) material,
PCB thickness:1.60mm thick,
Final copper:1 OZ finished copper on all layers,
Surface:ENIG surface finish,
Ttchnology:with hard gold finger at edge-board,
Solder mask:green solder mask, 
with impedance control
6.0/7.0mil min w/s(line width/spacing),
min drill bit:0.20mm,
min BGA pad size:0.33mm

if build the board. please send us Gerber file and bom list violet at akesoncircuit.com.cn

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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