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	Double Layer pcb prototype cheap price pcb manufacturer
 
	
Akeson® Detailed Product Description:
1) Layer: double sides pcb
2) Board finished thickness: 1.6mm
3) Material: FR-4
4) Min. drilled hole size: 0.6mm
5) Min. Line width: 0.5mm
6) Min.Line spacing: 0.5mm
7) Surface finish/treatment: Hasl lead free
8) Copper thickness: 2oz
10) Solder mask color: green/red
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Sample or mass produce, 3 to 8days lead time
	
Reference - Our Akeson® Production Capability for Multilayer PCB/Rigid borad
| 
				 Item 
  | 
			
				 M-  | 
		
| 
				 Layer count  | 
			
				 1-30 layers  | 
		
| 
				 Material  | 
			
				 FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui  | 
		
| 
				 Maxpanel size  | 
			
				 32±20(800mm±508mm)  | 
		
| 
				 Min width/space(min)  | 
			
				 4mil/4mil  | 
		
| 
				 Max copper weight  | 
			
				 140um(4oz) for inner layer 175um(5oz) for outer layer  | 
		
| 
				 Min machine drill size  | 
			
				 0.2mm(8mil)  | 
		
| 
				 Via hole tpye  | 
			
				 Blind/Burried/plugged  | 
		
| 
				 Thickness of finished board  | 
			
				 0.20-6.0mm  | 
		
| 
				 Tolerance  | 
			
				 Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm  | 
		
| 
				 Color of solder mask  | 
			
				 Green, Black, Blue,Red, White and so on  | 
		
| 
				 Surface freatment  | 
			
				 HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask  | 
		
| 
				 Hardness of solder solder  | 
			
				 >=6H  | 
		
| 
				 Outline finished  | 
			
				 CNC, V-CUT, Punching  | 
		
| 
				 Peel strength of line  | 
			
				 ≥61B/in  | 
		
| 
				 Warp and twist  | 
			
				 ≤0.7%  | 
		
	
 
	
 
| 
				 | 
			
				Quickly | 
			
				Sample(Normal) | 
			
				Mass(Normal) | 
		
| 
				Single-sided: | 
			
				1-2 days | 
			
				3-5 days | 
			
				7-8 days | 
		
| 
				Double-sided: | 
			
				2-3 days | 
			
				5-8 days | 
			
				8-10 days | 
		
| 
				4 Layers: | 
			
				3-4 days | 
			
				8-10 days | 
			
				10-12 days | 
		
| 
				6 Layers: | 
			
				5-6 days | 
			
				10-12 days | 
			
				12-14 days | 
		
| 
				8 Layers: | 
			
				6-8 days | 
			
				10-12 days | 
			
				14-16 days | 
		
| 
				10 Layers: | 
			
				8-10 days | 
			
				12-14 days | 
			
				16-18 days | 
		
| 
				12 Layers: | 
			
				10 days | 
			
				14-16 days | 
			
				16-18 days | 
		
| 
				>14 Layers: | 
			
				>=10 days | 
			
				>=16 days | 
			
				>=16 days | 
		
	
	
 
	
 
	U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab