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Akeson® BGA Assembly with X-Ray Inspection from China
We maintain high standards of excellence, strive for 100% customer's satisfaction and response within 24 hours
Send us: PCB/Gerber files, PCB requirements, BOM list, assembly or soldering technical requirements
Akeson® PCB Bare Board:
Multi-layer,FR4,Metal,Creamic,Rogers,FPC,HDI board.
HASL,Immersion Gold/silver/Au,OSP, etc.
PCB Assembly:
9 Testing Procedures,100% Functional Tested.
BGA with X-Ray and Lead Free Assembly.
Components Sourcing:
15 Years Purchasing Experience.
Multi-channel Component Supply.
Akeson® Finished products assembly:
Functional test/Programing.
Conformal Coating. Burning test.
Gift Box Packing. Storege Service.
Our advantages:
1, Online 360° Panoramic View Factory.
2, National High-tech Enterprise.
3, ISO9001, ISO13485, IATF16949 Certification.
4, Customade ERP To Control The Process.
5, No MOQ, Flexible Service.
Contact us to get quotation.
if have Gerber file and bom list. please send us violet at akesoncircuit.com.cn
Reference - Our Production Capability for Multilayer PCB/Rigid borad
|
Item
|
M- |
|
Layer count |
1-30 layers |
|
Material |
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui |
|
Maxpanel size |
32±20(800mm±508mm) |
|
Min width/space(min) |
4mil/4mil |
|
Max copper weight |
140um(4oz) for inner layer 175um(5oz) for outer layer |
|
Min machine drill size |
0.2mm(8mil) |
|
Via hole tpye |
Blind/Burried/plugged |
|
Thickness of finished board |
0.20-6.0mm |
|
Tolerance |
Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm |
|
Color of solder mask |
Green, Black, Blue,Red, White and so on |
|
Surface freatment |
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask |
|
Hardness of solder solder |
>=6H |
|
Outline finished |
CNC, V-CUT, Punching |
|
Peel strength of line |
≥61B/in |
|
Warp and twist |
≤0.7% |
|
|
Quickly |
Sample(Normal) |
Mass(Normal) |
|
Single-sided: |
1-2 days |
3-5 days |
7-8 days |
|
Double-sided: |
2-3 days |
5-8 days |
8-10 days |
|
4 Layers: |
3-4 days |
8-10 days |
10-12 days |
|
6 Layers: |
5-6 days |
10-12 days |
12-14 days |
|
8 Layers: |
6-8 days |
10-12 days |
14-16 days |
|
10 Layers: |
8-10 days |
12-14 days |
16-18 days |
|
12 Layers: |
10 days |
14-16 days |
16-18 days |
|
>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab
