The following is about Akeson® Panel Mount PCB Connector related, I hope to help you better understand Panel Mount PCB Connector.
Akeson® Panel Mount PCB Connector from China
The following is the introduction of high quality Panel Mount PCB Connector, hoping to help you better understand Panel Mount PCB Connector. Welcome new and old customers to continue to cooperate with us to create a better future!
CBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
• Component height: 0.2-25mm
• Min packing: 0201
• Min distance among BGA : 0.25-2.0mm
• Min BGA size: 0.1-0.63mm
• Min QFP space: 0.35mm
• Min assembly size: (X*Y): 50*30mm
• Max assembly size: (X*Y): 350*550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402, 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
DIP capability:
• A-8 of semi-assembly work line with 3 sets wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process
if have Gerber file and bom list. please send violet at akesoncircuit.com.cn
Reference - Our Production Capability for Multilayer PCB/Rigid borad
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Quickly |
Sample(Normal) |
Mass(Normal) |
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Single-sided: |
1-2 days |
3-5 days |
7-8 days |
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Double-sided: |
2-3 days |
5-8 days |
8-10 days |
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4 Layers: |
3-4 days |
8-10 days |
10-12 days |
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6 Layers: |
5-6 days |
10-12 days |
12-14 days |
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8 Layers: |
6-8 days |
10-12 days |
14-16 days |
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10 Layers: |
8-10 days |
12-14 days |
16-18 days |
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12 Layers: |
10 days |
14-16 days |
16-18 days |
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>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab
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Item
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M-
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Layer count
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1-30 layers
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Material
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FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
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Maxpanel size
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32±20(800mm±508mm)
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Min width/space(min)
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4mil/4mil
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Max copper weight
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140um(4oz) for inner layer
175um(5oz) for outer layer
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Min machine drill size
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0.2mm(8mil)
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Via hole tpye
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Blind/Burried/plugged
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Thickness of finished board
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0.20-6.0mm
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Tolerance
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Registration of innerlayer to of innerlayer:±3mil
Accuracy of hole position:±2mil
Tolerance of dilled slot:±3mil
Tolerance of PTH diameter:±3mil
Tolerance of NPTH diameter:±2mil
PTH hole copper thichness: 0.4-2mil
Image to image tolerance:±3mil
Tolerance of etching:±1mil
Solder mask registration tolerance: ±2mil
Finished board : Thickness<=1.0mm: +/-0.1mm
Thickness>0.1mm:+/-10%
Outline router: +/-0.1mm
Outline Score: +/-0.2mm
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Color of solder mask
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Green, Black, Blue,Red, White and so on
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Surface freatment
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HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
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Hardness of solder solder
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>=6H
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Outline finished
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CNC, V-CUT, Punching
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Peel strength of line
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≥61B/in
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Warp and twist
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≤0.7%
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