The
high-frequency circuit board includes a core board provided with a hollow groove and a copper clad laminate adhered to the upper and lower surfaces of the core board by flow glue. The upper and lower opening edges of the hollow groove are provided with ribs.
The high-frequency circuit board provided by the utility model is provided with ribs that can block the flow of glue at the upper and lower opening edges of the hollow groove of the core board. In this way, the core board and the covering on the upper and lower surfaces of the core board are provided. When the copper plate is bonded, the glue will not enter the hollow groove, that is, the bonding operation can be completed by one pressing. Compared with the high-frequency circuit board that can be completed by the second pressing in the prior art, the high-frequency circuit in the utility model The board has a simple structure, low cost and easy manufacture.
