The following is about Akeson® Circuit Board PCBA Design related, I hope to help you better understand Circuit Board PCBA Design.
Akeson® Detailed Product Description:
China PCBA Assembly OEM Manufacturing Shenzhen PCBA with One Stop PCBA Service
if have Gerber file and bom list. please send violet(@)akesoncircuit.com.cn
Printed circuit board
Akeson® pcb board
1) Layer: 4 layer
2) Board finished thickness: 1.6mm
3) Material: FR-4
4) Min. drilled hole size: 0.35mm
5) Min. Line width: 6mil (0.15mm)
6) Min.Line spacing: 6mil (0.15mm)
7) Surface finish/treatment:Immersion gold
8) Copper thickness: 1OZ
10) Solder mask color: green
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Sample or mass produce, 3 to 8 days lead time
Akeson® PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
Reference - Our Production Capability for Multilayer PCB/Rigid borad
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Item
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M-
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Layer count
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1-30 layers
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Material
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FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
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Maxpanel size
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32±20(800mm±508mm)
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Min width/space(min)
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4mil/4mil
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Max copper weight
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140um(4oz) for inner layer
175um(5oz) for outer layer
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Min machine drill size
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0.2mm(8mil)
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Via hole tpye
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Blind/Burried/plugged
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Thickness of finished board
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0.20-6.0mm
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Tolerance
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Registration of innerlayer to of innerlayer:±3mil
Accuracy of hole position:±2mil
Tolerance of dilled slot:±3mil
Tolerance of PTH diameter:±3mil
Tolerance of NPTH diameter:±2mil
PTH hole copper thichness: 0.4-2mil
Image to image tolerance:±3mil
Tolerance of etching:±1mil
Solder mask registration tolerance: ±2mil
Finished board : Thickness<=1.0mm: +/-0.1mm
Thickness>0.1mm:+/-10%
Outline router: +/-0.1mm
Outline Score: +/-0.2mm
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Color of solder mask
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Green, Black, Blue,Red, White and so on
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Surface freatment
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HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
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Hardness of solder solder
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>=6H
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Outline finished
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CNC, V-CUT, Punching
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Peel strength of line
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≥61B/in
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Warp and twist
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≤0.7%
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Quickly |
Sample(Normal) |
Mass(Normal) |
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Single-sided: |
1-2 days |
3-5 days |
7-8 days |
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Double-sided: |
2-3 days |
5-8 days |
8-10 days |
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4 Layers: |
3-4 days |
8-10 days |
10-12 days |
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6 Layers: |
5-6 days |
10-12 days |
12-14 days |
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8 Layers: |
6-8 days |
10-12 days |
14-16 days |
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10 Layers: |
8-10 days |
12-14 days |
16-18 days |
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12 Layers: |
10 days |
14-16 days |
16-18 days |
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>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab
