The following is about Akeson® High-density Multilayer PCBA related, I hope to help you better understand High-density Multilayer PCBA.
Akeson® High-density Multilayer PCBA
if have PCB copy. please send us sample to violet (at) akesoncircuit (doc) com (dot) cn
Mobile Phone Antenna Charger Copy Board
Analyse details,
printed circuit board parameters:
PCB Size: 75x75.5X2.5mm
double side layer.
material:1OZ FR-4
components quantity 50 +
Copy Board period: 1 Day
Copy Board File: Circuit Schematic Diagram, PCB file, Bom Special Material List
business: Copy Board sample PCB. With the production of sample surface and testing, batch PCBA processing
Akeson® PCB Ccopy prduction:
1. Wireless Communication Equipment: such as Wireless Base Station;
2. Optical network transmission equipment: such as SDH, DWDM equipment. 3. Data communication equipment: such as high-end Router, Lanswitch, ADSL, etc. .
4.High-end computing equipment: servers, motherboards and so on.
5. Multimedia Electronic Equipment: TV, HDTV, DVD, DVB, LCD TV, PDP, LCOS, DLP.
6. High-power switching power supply products: home appliances, computers, communications, switching power supply PCB design.
7. Power Electronic Equipment: FREQUENCY CONVERTER, UPS, industrial power supply, Industrial Control Board. Various Industrial Control PCB design.
8. Industrial Control Equipment, automotive control system, medical electronic equipment.
Reference - Our Production Capability for Multilayer PCB/Rigid borad
|
Item
|
M- |
|
Layer count |
1-30 layers |
|
Material |
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui |
|
Maxpanel size |
32±20(800mm±508mm) |
|
Min width/space(min) |
4mil/4mil |
|
Max copper weight |
140um(4oz) for inner layer 175um(5oz) for outer layer |
|
Min machine drill size |
0.2mm(8mil) |
|
Via hole tpye |
Blind/Burried/plugged |
|
Thickness of finished board |
0.20-6.0mm |
|
Tolerance |
Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm |
|
Color of solder mask |
Green, Black, Blue,Red, White and so on |
|
Surface freatment |
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask |
|
Hardness of solder solder |
>=6H |
|
Outline finished |
CNC, V-CUT, Punching |
|
Peel strength of line |
≥61B/in |
|
Warp and twist |
≤0.7% |
|
|
Quickly |
Sample(Normal) |
Mass(Normal) |
|
Single-sided: |
1-2 days |
3-5 days |
7-8 days |
|
Double-sided: |
2-3 days |
5-8 days |
8-10 days |
|
4 Layers: |
3-4 days |
8-10 days |
10-12 days |
|
6 Layers: |
5-6 days |
10-12 days |
12-14 days |
|
8 Layers: |
6-8 days |
10-12 days |
14-16 days |
|
10 Layers: |
8-10 days |
12-14 days |
16-18 days |
|
12 Layers: |
10 days |
14-16 days |
16-18 days |
|
>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab
