The following is about Akeson® Paper Punch PCB OEM PCBA With Remote Control DIP/SMT/FCT/Components related, I hope to help you better understand Paper Punch pcb OEM PCBA with Remote Control, DIP/SMT/FCT/Components Sourcing, PCB Assembly Solution.
Detailed Product Description
Akeson® Paper Punch PCB OEM PCBA With Remote Control DIP/SMT/FCT/Components
You are welcomed to come to our factory to buy the latest selling, low price, and high-quality Paper Punch pcb OEM PCBA with Remote Control, DIP/SMT/FCT/Components Sourcing, PCB Assembly Solution. We look forward to cooperating with you.
1) Layer: 8
2) Board finished thickness: 1.6mm
3) Material: FR-4
4) Min. drilled hole size: 0.5mm
5) Min. Line width: 8mil (0.2mm)
6) Min.Line spacing: 8mil (0.2mm)
7) Surface finish/treatment: Immersion gold
8) Copper thickness: 1 OZ
10) Solder mask color: Green
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Sample or mass produce, 3 to 6 days lead time
13) OEM/ODM is acceptable
China Akeson® PCBA Assembly OEM Manufacturing Shenzhen PCBA with One Stop PCBA Service
if have Gerber file and bom list. please send violet(@)akesoncircuit.com.cn
PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
Reference - Our Production Capability for Multilayer PCB/Rigid borad
|
Item
|
M- |
|
Layer count |
1-30 layers |
|
Material |
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui |
|
Maxpanel size |
32±20(800mm±508mm) |
|
Min width/space(min) |
4mil/4mil |
|
Max copper weight |
140um(4oz) for inner layer 175um(5oz) for outer layer |
|
Min machine drill size |
0.2mm(8mil) |
|
Via hole tpye |
Blind/Burried/plugged |
|
Thickness of finished board |
0.20-6.0mm |
|
Tolerance |
Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm |
|
Color of solder mask |
Green, Black, Blue,Red, White and so on |
|
Surface freatment |
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask |
|
Hardness of solder solder |
>=6H |
|
Outline finished |
CNC, V-CUT, Punching |
|
Peel strength of line |
≥61B/in |
|
Warp and twist |
≤0.7% |
|
|
Quickly |
Sample(Normal) |
Mass(Normal) |
|
Single-sided: |
1-2 days |
3-5 days |
7-8 days |
|
Double-sided: |
2-3 days |
5-8 days |
8-10 days |
|
4 Layers: |
3-4 days |
8-10 days |
10-12 days |
|
6 Layers: |
5-6 days |
10-12 days |
12-14 days |
|
8 Layers: |
6-8 days |
10-12 days |
14-16 days |
|
10 Layers: |
8-10 days |
12-14 days |
16-18 days |
|
12 Layers: |
10 days |
14-16 days |
16-18 days |
|
>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab
