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Akeson® ISO901 electronic low volume 4 layer PCBA / PCB electronic manufacturing assembly services from China
PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
Akeson® DIP capability:
• A-8 of semi-assembly work line with 3 set wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process
if have Gerber file and bom list. plesae send us violet at akesoncircuit.com.cn
we will quote soon
|
Item
|
M- |
|
Layer count |
1-30 layers |
|
Material |
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui |
|
Maxpanel size |
32±20(800mm±508mm) |
|
Min width/space(min) |
4mil/4mil |
|
Max copper weight |
140um(4oz) for inner layer 175um(5oz) for outer layer |
|
Min machine drill size |
0.2mm(8mil) |
|
Via hole tpye |
Blind/Burried/plugged |
|
Thickness of finished board |
0.20-6.0mm |
|
Tolerance |
Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm |
|
Color of solder mask |
Green, Black, Blue,Red, White and so on |
|
Surface freatment |
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask |
|
Hardness of solder solder |
>=6H |
|
Outline finished |
CNC, V-CUT, Punching |
|
Peel strength of line |
≥61B/in |
|
Warp and twist |
≤0.7% |
